BU05MB [TAIYO YUDEN]
RF Transformer;
| 型号： | BU05MB |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | RF Transformer 变压器 |
| 文件： | 总7页 (文件大小：183K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Notice for TAIYO YUDEN productsꢀ
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and For-
eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
notice_e-01
BALUN TRANSFORMERS
WAVE
REFLOW
M B：
M C：
■ FEATURES
■ APPLICATIONS
◦High stability due to pair wire windings
◦Impedance transformers
◦Distribution transformers
◦MC type : pins are molded into the base to create a singular structure
◦This item can be custom designed to meet customer requirements
■ OPERATING TEMP.
◦ー25℃～105℃（Including self-generated heat）
■ ORDERING CODE
B U 0 5 M B △ 0 1 △ △ ○
❶
❷
❸
❹
❺
❻
❶Type
BU Balun transformer
❷Length of component [mm]
❸Shape
pin type
❺Packaging
Tape & Reel
❻Internal code
Standard product
05
5.0、5.3
MB
MC
△T
△△
△
△＝Blank space
06
6.0
Surface-mount type
Bulk (Only pin type)
△＝Blank space
❹Product classification code
example
△01
△＝Blank space
■ EXTERNAL DIMENSIONS/MINIMUM QUANTITY
Pin type
MB (BU05MB, BU06MB)
Surface-mount type
MC (BU05MC)
Type
B
B
Fig.
D
D
Recommended Land Patterns
Minimum Quantity (pcs.)
Type
A
B
C
D
E
【BU05MC】
Box
Taping
0.5
0.5
5.5 max.
5.5 max.
6.0 max.
1.75±0.2
3.5
（0.138）
3.5～5.0
BU05MB
BU06MB
BU05MC
200
ー
（0.217 max.） （0.217 max.） （0.236 max.） （0.069±0.008）
1.4
3.2
1.4
8 max.
8 max.
8 max.
2.25±0.2 pitch
150
ー
（0.315 max.） （0.315 max.） （0.315 max.） （0.089±0.008）（0.138±0.197）
5.3±0.5
5.0±0.3
2.7±0.2
1.5±0.2 pitch
ー
ー
2500
（0.209±0.020）（0.197±0.012）（0.106±0.008）（0.059±0.008）
Unit : mm (inch)
1
1
1
Unit : mm (inch)
■ ELECTRICAL CHARACTERISTICS
The following chart shows typical ranges for operating characteristics.
Please specify the following when ordering.
① loss
② standing wave ratio (VSWR)
③ operating frequency
④ specified test circuit
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
trans01_e-01
120
■ PACKAGING
①Minimum Quantity
Type
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow
as illustrated below.
Minimum Quantity (pcs.)
Taping
Box
ー
200
BU05MC
BU05MB
BU06MB
2500
ー
ー
150
②Tape material
③Taping dimensions
◦Embossed tape 12mm wide (0.472 inches wide)
3.2
±0.1
2±0.1
8
±
0.1
0.004）
4±0.1
（0.157 0.004）
（
1.5+0.1
）
0
（0.126±0.004）
（0.079±0.004）
-
（0.315
±
（
0.059+0.004
）
1.75±0.1
（0.069±0.004）
-0
0.4±0.05
（0.016±0.002）
±
5.2±0.1
（0.209±0.004）
Unit : mm (inch)
④Leader and Blank portion
⑤Reel size
Label
13.5±1
（0.53±0.039）
Unit : mm (inch)
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
trans01_pack_e-01
trans01_pack-P1
■ RELIABILITY DATA
1. Operating Temperature Range
CM01
ー40℃～＋125℃
ー25℃～＋105℃
CM04RC
BU05MC
【Test Method and Remarks】
Including self-generated heat
2. Storage Temperature Range
CM01
CM04RC
BU05MC
ー40℃～＋85℃
【Test Method and Remarks】
ー5 to ＋40℃ in taped packaging
3. Rated current
CM01
CM04RC
Within the specified tolerance.
BU05MC
【Test Method and Remarks】
The maximum value of DC current within a specified rise of temperature individually.
4. Impedance
CM01
CM04RC
Within the specified tolerance.
BU05MC
【Test Method and Remarks】
Measuring equipment : HP 4291A or its equivalent
Measuring frequency : Specified frequency
5. DC Resisitance
CM01
CM04RC
BU05MC
Within the specified tolerance.
【Test Method and Remarks】
SMD transformer・Commom mode choke coil :
Measuring equipment : DC ohm meter
6. Resistance to flexure of substrate
CM01
Within the specified tolerance.
CM04RC
BU05MC
Refer to the individual specification.
【Test Method and Remarks】
According to JIS C 0051
CM01
2mm
CM04RC・BU05MC
Warp
3mm
Pressing speed
Duration
0.5mm/sec.
5±1sec.
7. Dielectric resistance : between wires
CM01
CM04RC
BU05MC
100MΩ min.
【Test Method and Remarks】
Applied voltage : Rated voltage
Duration
: 60 sec.
8. Rated voltage
CM01
CM04RC
Within the specification.
BU05MC
9. Withstanding voltage : between wires
CM01
CM04RC
BU05MC
No abnormality.
【Test Method and Remarks】
Applied voltage : Regulation voltage, DC250V（CM04RC）, DC125V（BU05MC）
Duration
: 60 sec.
10. Resistance to vibration
CM01
No abnormality observed in appearance
Refer to the individual specification.
CM04RC
BU05MC
【Test Method and Remarks】
According to JIS C 0040
Directions
: 2 hrs each in X, Y, and Z directions. Total : 6 hrs
Frequency range : 10 to 55 to 10 Hz (1 min.)
Amplitude
: 1.5mm (Shall not exceed acceleration 196m/s2)
Mounting method : soldering onto printed board
Recovery
: At least 2 hrs of recovery under the standard condition after the test,followed by the measurement within 48 hrs.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
co0102tr01_reli_e-01
co0102tr01_reli-RP1
■ RELIABILITY DATA
11. Solderability
CM01
At least 90% of terminal electrode is covered by new solder.
At least 75% of terminal electrode is covered by new solder.
CM04RC
BU05MC
【Test Method and Remarks】
CM01
245±5℃
3±1sec.
－
CM04RC・BU05MC
235±5℃
2±0.5sec.
Up to 0.5mm from terminal root
Solder temperature
Duration
Immersion depth
12. Resistance to solder Heat
CM01
Within the specified tolerance.
CM04RC
Refer to the individual specification.
BU05MC
【Test Method and Remarks】
CM01
CM04RC・BU05MC
Preheating
Peak
: 150 to 180℃ 1 to 2min
: 255±5℃ 5sec.
Preheating
Peak
: 100 to 150℃ 1 to 2min
: 230 to 240℃ within 5sec.
More than 200℃ within 40sec.
Reflow soldering
Manual soldering
230±5℃ 30～40sec.
Number of reflow : Within 2 times
Number of reflow: Within 2 times
Solder temperature : 350±5℃
Duration: 3±1sec.
Recovery : 1 to 2hrs of recovery under the standard
condition after the test.
－
13. Thermal shock
CM01
Within the specified tolerance.
Refer to the individual specification.
CM04RC
BU05MC
【Test Method and Remarks】
Accoding to JIS C 0025
Conditions of 1 cycle
Temperature (℃)
Time (min)
CM04RC・BU05MC
30±3
3
30±3
3
Step
CM01
CM04RC・BU05MC
ー25±3℃
Room Temp.
CM01
1
2
3
4
ー40±3℃
Room Temp.
85±2℃
85±3℃
Room Temp.
Room Temp.
Number of cycle : CM01
: 100 cycle
CM04RC・BU05MC : 10 cycle
Recovery : Recovery under the standard condition after removal from test chamber.
CM01 : Should be measured within 2 to 48hours.
CM04RC・BU05MC : Leave within 1 to 2 hours.
14. Loading under damp heat
CM01
Within the specified tolerance.
CM04RC
Refer to the individual specification.
BU05MC
【Test Method and Remarks】
CM01
60±2℃
CM04RC・BU05MC
40±3℃
90～95％RH
Temperature
Humidity
Applied current
Duration
Rated current
1000±24hrs
Recovery : Recovery under the standard condition after removal from test chamber.
CM01 : Should be measured within 2 to 48hours.
CM04RC・BU05MC : Leave within 1 to 2 hours.
15. High temperature life test
CM01
ー
CM04RC
Refer to the individual specification.
BU05MC
【Test Method and Remarks】
CM04RC・BU05MC
Temperature
Duration
85±3℃
1000±24hrs
Recovery : Recovery under the standard condition after removal from test chamber.
CM01 : Should be measured within 2 to 48hours.
CM04RC・BU05MC : Leave within 1 to 2 hours.
16. Low Temperature life Test
CM01
Within the specified tolerance.
CM04RC
Refer to the individual specification.
BU05MC
【Test Method and Remarks】
CM01
－40±2℃
CM04RC・BU05MC
－40±3℃
Temperature
Applied current
1000±24hrs
Recovery : Recovery under the standard condition after removal from test chamber.
CM01 : Should be measured within 2 to 48hours.
CM04RC・BU05MC : Leave within 1 to 2 hours.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
co0102tr01_reli_e-01
co0102tr01_reli-RP2
■ RELIABILITY DATA
17. Loading at high temperature life test
CM01
Within the specified tolerance.
CM04RC
ー
BU05MC
【Test Method and Remarks】
CM01
Temperature
Applied current
Duration
105±2℃
Rated current
1000±24hrs
Recovery : Recovery under the standard condition after removal from test chamber.
CM01 : Should be measured within 2 to 48hours.
CM04RC・BU05MC : Leave within 1 to 2 hours.
Note on standard condition :
"standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
co0102tr01_reli_e-01
co0102tr01_reli-RP3
■ PRECAUTIONS
CM04RC, BU05MC, CM01
1. Circuit Design
◆Operating environment
1.The products described in this specification are intended for use in general electronic equipment, (office supply equipment, telecommunications systems,
measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high
reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where
product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
Precautions
2. PCB Design
◆Land pattern design
Precautions
1.Please contact any of our offices for a land pattern, and refer to a recommended land pattern of specifications.
◆Land pattern design
Surface Mounting
・Mounting and soldering conditions should be checked beforehand.
・Applicable soldering process to these products is reflow soldering only.
・Recommended Land Patterns
【CM04RC】
（2 Lines）
【BU05MC】
0.5 0.5
【CM01】
（3 Lines）
（4 Lines）
Refer to the external dimension
drawing for the pin location.
Technical
consider-
ations
1.6
6.7
1.6
6.7
1.6
6.7
0.45
②
①
1.4
3.2
1.4
0.65 1.55
0.45
③
④
1.6
1.6
1.6
0.3
1.1
0.4
0.4
1
1
1
Unit: mm
1.8 0.74 1.8
1.8 0.74 1.8 0.74 1.8
1.8 0.74 1.8 0.74 1.8 0.74 1.8
3. Considerations for automatic placement
◆Adjustment of mounting machine
1.Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2.Mounting and soldering conditions should be checked beforehand.
Precautions
Technical
consider-
ations
◆Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
◆Reflow soldering
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. This product can be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
◆Lead free soldering
1.When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering heat, soldering etc sufficiently.
◆Recommended conditions for using a soldering iron
【CM04RC, BU05MC】
Precautions
・Put the soldering iron on the land-pattern.
・Soldering iron's temperature - Below 350℃
・Duration - 3 seconds or less
・The soldering iron should not directly touch the inductor.
【CM01】
・Please do not conduct an adjustment with a soldering iron because the wire would be broken due to its thinness.
Technical
consider-
ations
◆Reflow soldering
1.If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products.
5. Cleaning
Precautions
◆Cleaning conditions
1. Please contact any of our offices for a cleaning.
6. Handling
Precautions
◆Handling
1. Keep the product away from all magnets and magnetic objects.
◆Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push onto an exposed part of ferrite cores.
◆Packing
1. Please avoid accumulation of a packing box as much as possible.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considereed to minimize the stress caused from splitting of the PCBs.
Technical ◆Mechanical considerations
consider-
ations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆Pick-up pressure
1. An excessive shock or stress may cause a damage to the product or a detrioration of a characteristic.
◆Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
7. Storage conditions
◆Storage
1.To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled.
・Recommended conditions
Ambient temperature : 0～40℃, Humidity : Below 70% RH
Precautions
The ambient temperature must be kept below 30℃. Even under ideal storage conditions, the solderability of electrodes may decrease gradually. For this reason,
the products should be used within one year from the time of delivery. In case of storage over 6 months, solderability shall be checked before actual usage.
Technical ◆Storage
consider-
ations
1.Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration
oftaping/packaging materials may take place.
＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
co0102tr01_reli_e-01
co0102tr01_reli-RP4
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